Despite of hype, the Asus Eee Box nettop from Asustek Computer has not turned out to be a massive success, unlike the Eee PC netbooks. In a bid to improve popularity of the Eee Box, the firm unveiled new versions of the product with discrete graphics chip as well as HDMI support. Moreover, there are Eee Box solutions incoming with more advanced central processing unit (CPU) inside.
This week Asus unveiled its Eee Box B204 and B206 (with integrated battery that performs U.P.S. function) that are still based on is based on Intel Atom processor N270 (1.60GHz), Intel core-logic and feature 1GB of DDR2 memory, but now come with ATI Radeon HD 3400-series graphics cards with 256MB of memory onboard, high-definition multimedia interface as well as 160GB hard disk drive. The systems come equipped with remote controller. The new Eee Box machines still lack optical drive, but they feature 4-in-1 card reader, Gigabit Ethernet, Wi-Fi 802.11n controller and, most importantly, Windows XP Home operating system.
The inclusion of HDMI connectors as well as remotes is likely to attract attention of multimedia enthusiasts who would use the Eee Box in their living rooms. In addition, with HDMI support, the systems gain compatibility with multimedia-oriented displays with HDMI connectors.
But that is not all. In the coming weeks there will be more new Eee Boxes from Asustek. Instead of the single-core Intel Atom N270/1.60GHz that is presently installed into the Asus Eee Box, the company has reportedly decided to utilize Intel Celeron 220 chip with higher performance and also install larger 120GB hard disk drive into the device. The price of such systems will be lower than that of the initial Eee Box version to boost demand and will be about $240, according to DigiTimes web-site.
Low performance, insufficient storage space, too simplistic integrated graphics core and the lack of HDMI are the key reasons behind lackluster welcome of the Eee Box by the market. Unlike Eee PC, which provides ultimate mobility amid low price, a combination never seen before; the Eee Box could boast with low performance and affordable cost only, something that is very common since low-end PCs have been available since personal computer started to gain popularity back in the eighties.
With ATI Radeon HD 3400-series GPU inside, more capacious hard drive, HDMI support and remote controller, the Asus Eee PC B204/B206 can be easily considered as low-cost small form-factor PCs for the living room. Obviously, one can hardly play video games on such a systems, but the nettops of such kind should be fine for multimedia playback or streaming. Meanwhile, the rumoured Celeron-based Eee Boxes may gain acceptance on the market of office PCs.
Thursday, June 11, 2009
What's new in the VLSI Microprocessors
Intel has launched new Pentium-4 processor.
The Pentium-4 is fabricated in Intel's 0.18 micron CMOS process. Its die size is 217 mm2, power consumption is 50W. The Pentium 4 is available in 1.4GHz and 1.5Hz bins. At 1.5GHz the microprocessor delivers 535 SPECint2000 and 558 SPECfp2000 of performance. Currently it is the second-performing general-purpose microprocessor. The world champion is Compaq/Digital Alpha 21264B CPU delivering 544 SPECint2000 and 658 SPECfp2000 at 833 MHz. The previous Intel chip, Pentium-III "Coppermine", had 442 SPECint2000 and 335 SPECfp2000 results at 1GHz.
Pentium-4 is the first completely new x86-processor design from Intel since the Pentium PRO processor, with its P6 micro-architecture, was introduced in 1995. Pentium-4' micro-architecture is known as NetBurst. It has many interesting features.
- Compared to the Intel Pentium-III processor, Intel's NetBurst micro-architecture doubles the pipeline depth to 20 stages. In addition to the L1 8 KB data cache, the Pentium 4 processor includes an Execution Trace Cache that stores up to 12 K decoded micro-ops in the order of program execution. The on-die 256KB L2-cache is non-blocking, 8-way set associative. It employs 256-bit interface that delivers data transfer rate of 48 GB/s at 1.5 GHz. The Pentium 4 processor expands the floating-point registers to a full 128-bit and adds an additional register for data movement. Pentium-4' Net Burst micro-architecture introduces Internet Streaming SIMD Extensions 2 (SSE2). This extends the SIM D capabilities that MM X technology and SSE technology delivered by adding 144 new instructions. These instructions include 128-bit SIMD integer arithmetic and 128-bit SIM D double-precision floating-point operations. Pentium 4 processor's 400 MHz (100 MHz "quadpumped") system bus provides up to 3.2 GB/s of bandwidth. The bus is fed by dual PC800 Rambus channel. This compares to 1.06 GB/s delivered on the Pentium-III processor's 133-MHz system bus. Two Arithmetic Logic Units (ALUs) on the Pentium 4 processor are clocked at twice the core processor frequency. This allows basic integer instructions such as Add, Subtract, Logical AND, Logical OR, etc. to execute in a half clock cycle. The integer register file runs also runs at the double frequency. Interesting is that the this method was firstly introduced by Elbrus team in their E2K processor design. The E2K design was described in Microprocessor Report article by Keith Diefendorff in Feb 1999.
For more information on the new Intel Pentium-4 processor see official Intek press-release
The Pentium-4 is fabricated in Intel's 0.18 micron CMOS process. Its die size is 217 mm2, power consumption is 50W. The Pentium 4 is available in 1.4GHz and 1.5Hz bins. At 1.5GHz the microprocessor delivers 535 SPECint2000 and 558 SPECfp2000 of performance. Currently it is the second-performing general-purpose microprocessor. The world champion is Compaq/Digital Alpha 21264B CPU delivering 544 SPECint2000 and 658 SPECfp2000 at 833 MHz. The previous Intel chip, Pentium-III "Coppermine", had 442 SPECint2000 and 335 SPECfp2000 results at 1GHz.
Pentium-4 is the first completely new x86-processor design from Intel since the Pentium PRO processor, with its P6 micro-architecture, was introduced in 1995. Pentium-4' micro-architecture is known as NetBurst. It has many interesting features.
- Compared to the Intel Pentium-III processor, Intel's NetBurst micro-architecture doubles the pipeline depth to 20 stages. In addition to the L1 8 KB data cache, the Pentium 4 processor includes an Execution Trace Cache that stores up to 12 K decoded micro-ops in the order of program execution. The on-die 256KB L2-cache is non-blocking, 8-way set associative. It employs 256-bit interface that delivers data transfer rate of 48 GB/s at 1.5 GHz. The Pentium 4 processor expands the floating-point registers to a full 128-bit and adds an additional register for data movement. Pentium-4' Net Burst micro-architecture introduces Internet Streaming SIMD Extensions 2 (SSE2). This extends the SIM D capabilities that MM X technology and SSE technology delivered by adding 144 new instructions. These instructions include 128-bit SIMD integer arithmetic and 128-bit SIM D double-precision floating-point operations. Pentium 4 processor's 400 MHz (100 MHz "quadpumped") system bus provides up to 3.2 GB/s of bandwidth. The bus is fed by dual PC800 Rambus channel. This compares to 1.06 GB/s delivered on the Pentium-III processor's 133-MHz system bus. Two Arithmetic Logic Units (ALUs) on the Pentium 4 processor are clocked at twice the core processor frequency. This allows basic integer instructions such as Add, Subtract, Logical AND, Logical OR, etc. to execute in a half clock cycle. The integer register file runs also runs at the double frequency. Interesting is that the this method was firstly introduced by Elbrus team in their E2K processor design. The E2K design was described in Microprocessor Report article by Keith Diefendorff in Feb 1999.
For more information on the new Intel Pentium-4 processor see official Intek press-release
AMD Strains Silicon in New Microprocessors. Advanced Micro Devices Adopts New Chip Making Tech
Advanced Micro Devices is reportedly adopting strained silicon for an array of its processors that will be available this Fall. The design tweak is likely to improve the company’s ability to ship high-speed microprocessors while maintaining sufficient yield as well as keeping heat dissipation of the products into generally-acceptable envelope.
Silicon-on-Insulator and strained silicon appear to be the technologies that AMD, Intel and IBM pin a lot of hopes on during the next three to five years. Both technologies are intended to keep increasing the speed of current flowing through a microprocessor and to address the connected issues, such as power leakage. SOI adds a thin oxide layer to a silicon wafer in order to insulate the circuit against power leakage. Strained silicon, in its incarnation that is used by Intel Corp. and IBM, deposits a layer of silicon germanium on top of a silicon wafer. This stretches the silicon atoms to let electrons flow faster through a circuit.
According to reports from Semiconductor Reporter and CNET News.com, Advanced Micro Devices is incorporating strained silicon into all the firm’s 90nm microprocessors that started shipping last week. Additionally, the Sunnyvale, California-based chip maker is expected to use strained silicon with its future 130nm microprocessors, which is a rather surprising move, as chip makers typically tend to migrate to thinner fabrication processes to allow higher-speed chips and decrease production costs, but not to advance older-generation manufacturing technologies.
Representatives for Advanced Micro Devices are reported to have said that strained silicon approach of the company is different from what IBM and Intel Corp. use. Silicon can be strained as a byproduct of other design changes, but the AMD representative said the company intentionally incorporated new layers in chips to achieve straining, although AMD does not give a lot of details about its new technology.
IBM and AMD are developing 65nm manufacturing process in collaboration. AMD’s Silicon-on-Insulator process was originally developed by IBM.
Silicon-on-Insulator and strained silicon appear to be the technologies that AMD, Intel and IBM pin a lot of hopes on during the next three to five years. Both technologies are intended to keep increasing the speed of current flowing through a microprocessor and to address the connected issues, such as power leakage. SOI adds a thin oxide layer to a silicon wafer in order to insulate the circuit against power leakage. Strained silicon, in its incarnation that is used by Intel Corp. and IBM, deposits a layer of silicon germanium on top of a silicon wafer. This stretches the silicon atoms to let electrons flow faster through a circuit.
According to reports from Semiconductor Reporter and CNET News.com, Advanced Micro Devices is incorporating strained silicon into all the firm’s 90nm microprocessors that started shipping last week. Additionally, the Sunnyvale, California-based chip maker is expected to use strained silicon with its future 130nm microprocessors, which is a rather surprising move, as chip makers typically tend to migrate to thinner fabrication processes to allow higher-speed chips and decrease production costs, but not to advance older-generation manufacturing technologies.
Representatives for Advanced Micro Devices are reported to have said that strained silicon approach of the company is different from what IBM and Intel Corp. use. Silicon can be strained as a byproduct of other design changes, but the AMD representative said the company intentionally incorporated new layers in chips to achieve straining, although AMD does not give a lot of details about its new technology.
IBM and AMD are developing 65nm manufacturing process in collaboration. AMD’s Silicon-on-Insulator process was originally developed by IBM.
new inventions
At the International Solid State Circuits Conference (ISSAC) today, IBM, Sony Corporation, Sony Computer Entertainment Inc. (Sony and Sony Computer Entertainment collectively referred to as Sony Group) and for the first time disclosed in detail the breakthrough multi-core architectural design – featuring supercomputer-like floating point performance with observed clock speeds greater than 4 G Hz – of their jointly developed microprocessor code-named Cell.
A team of IBM, Sony Group and Toshiba engineers has collaborated on development of the Cell microprocessor at a joint design center established in Austin, Texas, since March 2001. The prototype chip is 221 mm2, integrates 234 million transistors, and is fabricated with 90 nanometer SOI technology.
Cell's breakthrough multi-core architecture and ultra high-speed communications capabilities deliver vastly improved, real-time response for entertainment and rich media applications, in many cases 10 times the performance of the latest PC processors.
Effectively a "supercomputer on a chip" incorporating advanced multi-processing technologies used in IBM's sophisticated servers, Sony Group's computer entertainment systems and Toshiba's advanced semiconductor technology, Cell will become the broadband processor used for industrial applications to the new digital home.
Another advantage of Cell is to support multiple operating systems, such as conventional operating systems (including Linux), real-time operating systems for computer entertainment and consumer electronics applications as well as guest operating systems for specific applications, simultaneously.
Initial production of Cell microprocessors is expected to begin at IBM's 300mm wafer fabrication facility in East Fish kill, N.Y., followed by Sony Group's Nagasaki Fab, this year. IBM, Sony Group and Toshiba expect to promote Cell-based products including a broad range of industry-wide applications, from digital televisions to home servers to supercomputers.
A team of IBM, Sony Group and Toshiba engineers has collaborated on development of the Cell microprocessor at a joint design center established in Austin, Texas, since March 2001. The prototype chip is 221 mm2, integrates 234 million transistors, and is fabricated with 90 nanometer SOI technology.
Cell's breakthrough multi-core architecture and ultra high-speed communications capabilities deliver vastly improved, real-time response for entertainment and rich media applications, in many cases 10 times the performance of the latest PC processors.
Effectively a "supercomputer on a chip" incorporating advanced multi-processing technologies used in IBM's sophisticated servers, Sony Group's computer entertainment systems and Toshiba's advanced semiconductor technology, Cell will become the broadband processor used for industrial applications to the new digital home.
Another advantage of Cell is to support multiple operating systems, such as conventional operating systems (including Linux), real-time operating systems for computer entertainment and consumer electronics applications as well as guest operating systems for specific applications, simultaneously.
Initial production of Cell microprocessors is expected to begin at IBM's 300mm wafer fabrication facility in East Fish kill, N.Y., followed by Sony Group's Nagasaki Fab, this year. IBM, Sony Group and Toshiba expect to promote Cell-based products including a broad range of industry-wide applications, from digital televisions to home servers to supercomputers.
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